Cleanroom

BRNC

BRNC

The 950 m² BRNC external pagecleanroom features class 100/1000 facilities including class 10 mini-environments with advanced micro- and nanofabrication capabilities.

Micro- and nanofabrication capabilities:

Optical contact printers (Frontside/Backside alignment, UV options)
Laser writer (for masks and direct write, resolution approx. 0.7 micron)
High-resolution e-beam litho (20 / 50 100 kV)
Resist processing (coat, bake, develop, strip, ...)
Thermal probe lithography
3D Photolithography
Nanoimprint lithography

Wafer cleaning (Std. Si cleans, ...)
Wet etching (Si, III/V, Metals, Oxides/Nitrides, ...)
Critical point dryer

3 Evaporators (e-beam and thermal, for deposition of dielectric and metal layers)
2 Sputter Tools (one cluster tool, one single chamber)
PECVD for Si-oxides, Si-nitrides, a-Si, BPSG, TEOS
2 ALD (one plasma, one thermal)
Ion Beam Deposition (for dielectric mirror stacks and single layers)
Pulsed Laser Deposition (PLD) for complex oxides and piezoelectric materials

Thermal Oxidation of Silicon (Wet and dry oxidation)
LPCVD (Poly-Si, Si-nitride, TEOS)
2 Rapid thermal annealers

2 RIEs: Fluorine-based chemistry
2 ICP-RIEs: Chlorine-based, CH4/H2, HBr
Ion Milling: non-reactive ion beam etching
Silicon deep trench etcher: Bosch-Process
XeF2 etcher (anisotropic Si etching)
HF vapor phase etcher

Carbon CVD 4inch (CNT and graphene deposition)
Carbon CVD 6inch (CNT and graphene deposition)
2D growth tool (CNT, graphene, h-BN, TMDC)

Dual beam FIB
SEM (with EDX)
AFM
Ellipsometer (scanning wavelength 190 - 3300 nm)
Reflectometer
Raman spectroscopy
2 Surface profilers
White light interferometer
Wafer probe station (electrical and optical characterization)
Optical microscopes

Manual wire bonder
2 Flip chip bonders
Wafer bonder
Lapping / polishing tool
CMP
Electroplating
Wafer Dicing